Capabilities

DESCRIPTION	MASS PRODUCTION CAPABILITY	QUICK-TURN PCB CAPABILITY
Min / Max Layers	One (1) layer to 26 Layers	One (1) layer to 32 Layers
Pattern Density (Min. Line/Space)	3 mils / 3 mils (for confirmation upon review of gerber files)	3 mils / 3 mils
Outer Layer Circuitry	3 mils / 3 mils	3 mils / 3 mils
Inner Layer Circuitry	3 mils / 3 mils	3 mils / 3 mils
Min Board Thickness	2L - 16 mils; 4L - 18 mils; 6L up - 18 mils	4L and up - 12 mils
Min Finished Hole Size	8 mils; special: 4 mils	4 mils
Min Hole Size (Laser Drill)	micro via 0.10 mm mechanical / special 0.05	0.15 – 0.25mm
BGA pitch	0.30 – 0.35 mm	0.30 – 0.35 mm
High Density Interconnect (HDI) Board	MLB, HDI+1, HDI+2, HDI+3, HDI+4	MLB, HDI+1, HDI+2, HDI+3, HDI+4
Aspect ratio	12 : 1	22 : 1
Min Core Thickness	4 mils	2 mils
Min Prepreg Thickness	30 – 40 um	25 – 30 um
Min Soldermask Bridge	50 – 60 um	50 – 56 um
Buried / Blind Vias	YES	YES

Fine Line / Pitch	40 / 40 um	50 / 50 um (2 mils) / 0.35 mm pitch / 0.4 mm with 2 line
SMT Spacing	10 mils - SMT; 6 mils BGA	8 mils - SMT; 4 mils BGA
>Surface Finish	Flash Gold, Hard Gold, ENIG, Immersion Tin, Immersion Silver, Silver Thru Hole, Carbon Resistance, Peelable Mask, OSP, HASL, HASL Lead-free, ENEPIG, GF	OSP, Flash Gold, Hard Gold 50µ",ENIG, Immersion Silver, Immersion Tin, HASL, Carbon Resistance, HASL Lead-free, ENEPIG, GF
HDI Layers	MLB, HDI+1, HDI+2, HDI+3, HDI+4	MLB, HDI+1, HDI+2, HDI+3, HDI+4
Controlled Impedance	(+/-) 5% tol	(+/-) 5% tol
Largest Panel Size	24.00" x 36.00"	24.00" x 36.00"
Type of Materials	FR-4, CEM-3, FR-4 high Tg, Getek, Rogers, Gil/GML, Heavy Copper up to 5 oz, RoHS compliant, Aluminum base, Aluminum substrate,	FR-4, CEM-3, FR-4 high Tg, Getek, Rogers, Gil/GML, Heavy Copper up to 5 oz, RoHS compliant, Aluminum base, Aluminum substrate
Others	Via in pad, semi-hole, multi-drill/multi-function blind via hole, conductive via plugging, electroplating gold (50u") ELIC Boards, HDI Boards, Different Micro vias structure. Flex and flex Rigid Circuit Boards.